3
5
6
7
8
F
E
D
C
B
A
5
6
7
8
FH-P9200MP/ES
CONTENTS
SAFETY INFORMATION .............................................................................................................2
1. SPECIFICATIONS ........................................................................................................................4
2. EXPLODED VIEWS AND PARTS LIST........................................................................................6
2.1 PACKING ...............................................................................................................................6
2.2 EXTERIOR(1) .........................................................................................................................8
2.3 EXTERIOR(2) .......................................................................................................................10
2.4 CD MECHANISM MODULE................................................................................................12
2.5 MD MECHANISM MODULE...............................................................................................14
3. BLOCK DIAGRAM AND SCHEMATIC DIAGRAM....................................................................16
3.1 BLOCK DIAGRAM ...............................................................................................................16
3.2 OVERALL CONNECTION DIAGRAM(GUIDE PAGE) .........................................................18
3.3 FLAP PCB UNIT...................................................................................................................24
3.4 CD MECHANISM MODULE(GUIDE PAGE) .......................................................................26
3.5 MD MECHANISM MODULE(GUIDE PAGE) ......................................................................36
3.6 DSP UNIT ............................................................................................................................46
3.7 PANEL PCB UNIT ................................................................................................................48
4. PCB CONNECTION DIAGRAM.................................................................................................50
4.1 AUDIO AMP UNIT...............................................................................................................50
4.2 FLAP PCB UNIT...................................................................................................................54
4.3 CD MECHANISM MODULE................................................................................................56
4.4 MD MECHANISM MODULE...............................................................................................58
4.5 PANEL PCB UNIT ................................................................................................................61
4.6 DSP UNIT ............................................................................................................................62
5. ELECTRICAL PARTS LIST .........................................................................................................64
6. ADJUSTMENT ..........................................................................................................................76
6.1 CD ADJUSTMENT ..............................................................................................................76
6.2 CHECKING THE GRATING AFTER CHANGING THE PICKUP UNIT ................................78
6.3 MD ADJUSTMENT .............................................................................................................80
6.4 ERROR MODE(CD)..............................................................................................................83
6.5 TEST MODE(MD) ................................................................................................................84
6.6 SYSTEM MICROCOMPUTER TEST PROGRAM ...............................................................88
7. GENERAL INFORMATION ........................................................................................................88
7.1 DIAGNOSIS .........................................................................................................................88
7.1.1 DISASSEMBLY ..............................................................................................................88
7.1.2 CONNECTOR FUNCTION DESCRIPTION....................................................................95
7.2 IC ..........................................................................................................................................96
7.3 OPERATIONAL FLOW CHART..........................................................................................113
7.4 CLEANING.........................................................................................................................114
8. OPERATIONS ..........................................................................................................................115